迅为三星Exynos4412嵌入式开发板硬件系统介绍

iTOP-4412开发板选用‘核心板+底板’框架。其间核心板为8层沉金工艺,并有POP和SCP两种封装方式供用户选择;底板为4层沉金,均选用大厂工艺,质量安稳。本资料共包括以下附件:

(The iTOP-4412 development board uses the 'core board base board' framework. The core board is made of 8-layer gold deposition process, and there are POP and SCP packaging methods for users to choose; The base plate is made of four layers of gold, which are all manufactured by a large factory with stable quality. This document includes the following annexes:)

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